Layer:single-sided,double-sided,and other structure layer
metal base thickness: 0.5~3.2(mm)
Copper foil thickness: 1~7(oz)
Insulating layer thickness: 50~150 (micron)
Surface treatment: HAL(lead free), Immersion Gold,OSP
Min. Drilled hole size: 0.15mm
Min.Line width: 0.1mm
Min.Line spacing: 0.1mm
Copper base PCB